▎ 摘　　要

NOVELTY - The utility model claims an embedded radiating type ceramic substrate, comprising a ceramic body, an upper line layer, a lower line layer, an inner graphene of the heat conducting layer, an upper graphene of the heat conducting layer, a first lower graphene of the heat conducting layer and a second lower graphene of the heat conducting layer; The ceramic body comprises a base part and a convex part integrally extended on the base part, the concave part of the convex part is formed with a packaging cavity with upward opening for embedding the electronic device, the bottom surface of the packaging cavity is provided with a conductive hole, the first heat conducting hole and the second heat conducting hole, the first heat conducting column, the second heat conducting column, the upper graphene of the heat conducting layer is provided with a heat conducting layer, a first lower graphene heat conducting layer and a second lower graphene heat conducting layer, so that the heat generated by the electronic device embedded in the package can be quickly derived, which effectively improves the heat conducting efficiency, the radiating effect is more ideal, the packaging requirement of the large power device is completely satisfy