• 专利标题:   Electron flow heat pump assembly, has channel for pumping heat by flow of electrical charges, where channel is on average charge-neutral, and electrical charges are distributed along channel as wave-like density variations.
  • 专利号:   WO2023279088-A1
  • 发明人:   ANDREEV A, COBDEN D
  • 专利权人:   UNIV WASHINGTON SEATTLE
  • 国际专利分类:   F25B030/00, H01L035/00, H02K003/22, H02K003/24
  • 专利详细信息:   WO2023279088-A1 05 Jan 2023 H01L-035/00 202308 Pages: 29 English
  • 申请详细信息:   WO2023279088-A1 WOUS073357 01 Jul 2022
  • 优先权号:   US218192P

▎ 摘  要

NOVELTY - The assembly (100) has a channel that is made of a monolayer graphene or a natural bilayer graphene. The electrical charges in the channel are excited by an alternating current (AC) source and a piezoelectric vibrator. The electrical charges are arranged in wave-like density variations along the channel in response to exciting the electrical charges. The heat is pumped along the channels by the wave-like density variations, where the channel is on average charge-neutral. A characteristic frequency of a flow of electrical charges is more than one order of magnitude higher than a characteristic frequency. USE - Method for pumping heat using electron flow in microelectronic devices. Uses include but are not limited to electronic cooling and small-scale refrigeration. ADVANTAGE - The heat transfer efficiency of the heat pump assembly can be improved. The efficiency of heat transfer from one side of the device to another side can be increased. The energy losses can be reduced. The heat can be pumped efficiently. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for pumping heat using electron flow. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat pump. 10Pump Channel 20Heat Flow 100Heat Pump Assembly