• 专利标题:   Preparing graphene microsphere used for preparing high-thermal-conductivity gasket, involves using graphene heat-conducting film and artificial graphite heat-conducting film as base material, and preparing graphene powder using crushing process, and preparing graphene microspheres by sol method.
  • 专利号:   CN113086975-A, CN113086975-B
  • 发明人:   LI F, GE X, LI Z, ZHOU B
  • 专利权人:   HANGZHOU FUXI TECHNOLOGY CO LTD
  • 国际专利分类:   C01B032/184, C01B032/194, C08K007/16, C08L033/04, C08L063/00, C08L075/04, C08L083/04
  • 专利详细信息:   CN113086975-A 09 Jul 2021 C01B-032/184 202173 Pages: 17 Chinese
  • 申请详细信息:   CN113086975-A CN10490095 06 May 2021
  • 优先权号:   CN10490095

▎ 摘  要

NOVELTY - Method for preparing graphene microsphere, involves (a) taking graphene heat-conducting film, artificial graphite heat-conducting film and/or highly oriented graphite heat-conducting film as base material, and preparing graphene powder using crushing process, and (b) preparing graphene microspheres by sol method by (i) dissolving resorcinol in aqueous formaldehyde aqueous solution, adding graphene powder, heating and uniformly stirring to obtain mixed solution, (ii) heating liquid paraffin at 70-100 degrees C, adding mixed solution to liquid paraffin, continuously stirring to obtain phenolic resin-wrapped graphene microsphere, filtering phenolic resin-wrapped graphene microsphere, collecting filter residue and washing filter residue to obtain solid product, and (iii) sequentially performing baking, high-temperature carbonization and high-temperature graphitization process on obtained solid product to obtain graphene microspheres. USE - Method for preparing graphene microsphere used for preparing high-thermal-conductivity gasket (claimed). ADVANTAGE - The method improves the problem of low thermal conductivity of traditional thermal conductivity gaskets. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a graphene microsphere prepared by applying above-mentioned preparation method; and (2) a method for preparing high-thermal-conductivity gasket, involving (I) taking raw materials comprising substrate materials and fillers, where the filler comprises above-mentioned graphene microspheres, and the substrate material comprises silicone resin, an epoxy resin, acrylic resin and/or polyurethane resin, (II) pre-mixing filler, and adding substrate material for mixing to obtain mixed material, (III) transferring obtained mixed material to vacuum furnace for vacuuming under vacuum degree of 1-100 Pa/cm, preferably 5 Pa/cm for 1-60 minutes, preferably 30 minutes and defoaming, and (IV) curing obtained material.