▎ 摘　　要

NOVELTY - This new utility model relates to heating technology area, especially relates to a kind of one semiconductor heating device. Comprising semiconductor heating element, and the heating element power semiconductor as the semiconductor heating element connected with power supply and power supply unit, the semiconductor heating element comprises semiconductor heating plate, said semiconductor heating plate comprises used for releasing heat of heat terminal, used for absorb cold side of heat quantity, is set with the P type semiconductor and N type semiconductor at the hot end and the cold end between, and connected with the N type semiconductor and metal conductor and the P type semiconductor, the metal conductor is set with used for connected with positive negative electrode of the power source, wherein the N type semiconductor is set with graphene, or the P type semiconductor is set with graphene, or said N type semiconductor and said P type semiconductor are provided with graphene. The semiconductor heating plate increase heat cold end of temperature difference, to increase semiconductor heating plate heating ability and target.