▎ 摘　　要

NOVELTY - High-resilience and low-thermal-resistance interface material comprises a graphene heat-conducting film (1), where the graphene heat-conducting film runs through and provided with some heat-conducting holes (2), the heat-conducting holes is filled with a thermally conductive slurry, and the thermally conductive slurry includes 50-700 pts. wt. carbon fiber, 500-1700 pts. wt. thermally conductive powder, 50-120 pts. wt. silicone oil, 0.3-2 pts. wt. coupling agent, 1-4 pts. wt. curing agent, 0.1-1 pts. wt. inhibitor, and 1-4 pts. wt. catalyst. The carbon fibers are oriented and arranged along the opening direction of the heat conduction holes. USE - High-resilience and low-thermal-resistance interface material. ADVANTAGE - The high-resilience and low-thermal-resistance interface material provides good heat conducting effect for graphene heat conducting film in the vertical direction, and improves the whole heat-conducting performance and compression resilience performance graphene the heat-conducting film. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a high-resilience and low-thermal-resistance interface material, which involves: a. preparing graphene heat conduction film; b. subjecting graphene thermal conduction film to make offer thermal conduction holes; and c. filling the heat conduction slurry into the heat conduction hole by dispensing glue, and aligning the carbon fibers along the opening direction of the heat conduction hole, and then curing to obtain a product. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a high-resilience and low-thermal-resistance interface material. 1Graphene heat conducting film 2Heat conducting hole