▎ 摘　　要

NOVELTY - Preparing high temperature resistant thermosetting supramolecular shape memory polyimide comprises (i) mixing graphene oxide, organic solvent, diamine and dianhydride and polycondensing to obtain a dianhydride-terminated polyamic acid solution, (ii) mixing boron source containing the amino group with the polyamic acid solution terminated by the dianhydride, carrying out polycondensation reaction to obtain the polyamic acid solution terminated by borate ester, where the boron source containing amino groups includes boric acid esters containing amino groups and/or boric acids containing amino groups, and (iii) subjecting the borate-terminated polyamic acid solution to solvent removal and thermal imidization in sequence to obtain high temperature resistant thermosetting supramolecular shape memory polyimide. USE - The polyimide is used in aerospace, biomedicine and other fields. ADVANTAGE - The high temperature resistant thermosetting supermolecular shape memory polyimide: can generate fast boron-oxygen bond exchange reaction at high temperature; realizes complex shape forming; has excellent high temperature replasticity and welding function; realizes the light response shape memory and light control shape remodelling, welding and reprocessing; and has high glass transition temperature. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for the high temperature resistant thermosetting supermolecule shape memory polyimide to any one of claims to prepared by the preparation method.