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  • 专利标题:   Low-viscosity conductive adhesive composition useful in e.g. electronic products, comprises epoxy resin, active diluent, viscosity auxiliary agent e.g. non-crosslinked product of amino-terminated nitrile rubber liquid and polyepoxy monomer, curing agent and accelerator and modified conductive filler.
  • 专利号:   CN114656911-A, CN114656911-B
  • 发明人:   LIN H, LI S, CHEN C, ZHANG X
  • 专利权人:   WELDTONE XIAMEN TECHNOLOGY CO LTD, WELDTONE TECHNOLOGY CO LTD
  • 国际专利分类:   C09J011/00, C09J011/04, C09J011/08, C09J163/02
  • 专利详细信息:   CN114656911-A 24 Jun 2022 C09J-163/02 202276 Chinese
  • 申请详细信息:   CN114656911-A CN10369458 08 Apr 2022
  • 优先权号:   CN10369458

▎ 摘　　要

NOVELTY - Low-viscosity conductive adhesive composition comprises 100 pts. wt. of epoxy resin, 0-15 pts. wt. active diluent, 10-40 pts. wt. viscosity auxiliary agent, 1-10 pts. wt. curing agent, 1-6 pts. wt. curing accelerator and 5-20 pts. wt. modified conductive filler. The viscosity auxiliary agent is non-crosslinked reaction product of amino-terminated nitrile rubber liquid and polyepoxy monomer. The modified conductive filler is obtained by surface treating conductive filler with viscosity auxiliary agent. USE - The low-viscosity conductive composition is useful in conductive adhesive technical field and electronic products. ADVANTAGE - The conductive adhesive composition has high conductivity and high toughness of cured coating, and low viscosity.