▎ 摘　　要

(US2022369494-A1) NOVELTY - The apparatus has an alternating current (AC)/direct current (DC) power supply for providing power to a power consumer selected from a group consisting of servers in an internet data center and a stand-alone server. The power supply comprises a power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by the circuitry. The system comprises a thermal network that provides solid-state thermally-conductive pathways between the circuitry and faces of a housing. The circuitry comprises a unit that is connected to the faces of the housing by the pathways. USE - Apparatus for cooling power supply for server in internet data center ADVANTAGE - The apparatus eliminates the fluid middleman by carrying out heat dissipation passively using solid-state components to rapidly conduct heat to multiple faces of housing. DETAILED DESCRIPTION - Apparatus comprises a cryptocurrency mining rig for mining cryptocurrency. The cryptocurrency mining rig comprising an ac/dc power supply, where power supply comprises power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by power-handling circuitry, and a mining machine that receives power from said ac/dc power supply. The passive heat-dissipation system comprises a housing that encloses power-handling circuitry and a thermal network that provides solid-state thermally-conductive pathways between power-handling circuitry and faces of housing, where power-handling circuitry comprises a power-handling unit that is connected to first and second faces of housing by corresponding first and second solid-state thermally-conductive pathways. The thermal network comprises a structure selected from the group consisting of a first structure, which comprises a multi-layer printed-circuit board comprising a set of heat-conducting layers and an electromagnetic-interference shield that is in thermal communication with printed-circuit board. The power-handling circuitry comprises a power unit that is surface mounted onto multi-layer printed-circuit board and that is in thermal communication with multi-layer set of heat-conducting layers. A second structure, which comprises a projection that is in thermal communication with housing, that projects into housing, and that has a recess. The power-handling circuitry comprises a power unit that is nestled in recess, and where recess conforms to power unit. A fourth structure, which comprises a perforated graphene layer having perforations filled with a thermally-conductive material. A fifth structure, which comprises a polymer-filled tank having walls in contact with housing, and where power-handling circuitry comprises a component immersed in tank. A sixth structure, which comprises a conducting strip inlaid into housing, conducting strip having a thermal resistance that is lower than that of housing. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of an apparatus. 14Housing 16Server 18Router 20Rack 24Power supply