▎ 摘　　要

NOVELTY - The device (10) has a semiconductor die (12) provided with a surface. A conductive component is provided with first and second ends. A package material is formed on the semiconductor die. The package material is provided with a surface. The first end of the conductive component is arranged on the surface of the package material. A thermally-conductive layer is arranged on the surface of the package material and the first end of the conductive component. The thermally-conductive layer faces the surface of the semiconductor die, where the thermally-conductive layer includes graphene. USE - Semiconductor device e.g. integrated circuit and power device. ADVANTAGE - The device provides thermal dissipation paths for a graphene layer to provide ground connection of the graphene layer for facilitating providing electromagnetic interference (EMI) shielding of the semiconductor die. The device achieves low-cost and small dimension EMI shielding. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: (1) an apparatus implementing packaging for semiconductor devices (2) a method for implementing packaging for semiconductor devices. DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of a semiconductor device. Semiconductor device (10) Semiconductor die (12) Die pad (16) Package (18) Electrically conductive lead (20)