▎ 摘　　要

NOVELTY - Computing device, comprises substrate (104), die coupled to substrate, heat spreader (106) thermally coupled to die (102) and comprising body of thermally conductive material having cavity (112) partially surrounding die, and graphene layer (110) contacting surface of body. USE - Computing device i.e. central processing units (CPU). ADVANTAGE - The heat spreader is thermally coupled to a die, which improves heat transfer efficiency of the die is improved. The die is cooled to ensure stable performance of the computing device and distribution of a heat spreader through the use of a graphene layer. The cooling of the dies is improved by the use of the heat sink and the heat exchanger. The heat spreader also increases overall cooling efficiency, allowing for dies to operate at higher performance levels and generate more heat by maintaining temperatures of the die. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a method of coupling a die to a substrate; and (2) a heat spreader for integrated circuit dies. DESCRIPTION OF DRAWING(S) - The diagram shows an example integrated circuit device assembly including a graphene-coated heat spreader. 102Die 104Substrate 106Heat spreader 110Graphene layer 112Cavity