▎ 摘 要
NOVELTY - Double-layer hollow structure porous carbon-nickel iron oxide electromagnetic shielding material comprises 36-55 pts. wt. nano-nickel iron oxide-graphene composite material, 5-10 pts. wt. polystyrene microspheres, 18-22 pts. wt. surfactants, 18-24 pts. wt. ethyl orthosilicate, 4-8 pts. wt. crosslinking agent. USE - Double-layer hollow structure porous carbon-nickel iron oxide electromagnetic shielding material. ADVANTAGE - The double-layer hollow structure porous carbon-nickel iron oxide electromagnetic shielding material has good nano-morphology, high magnetic permeability of NiFe2O4 and achieves good impedance match. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing double-layer hollow structure porous carbon-nickel iron oxide electromagnetic shielding material, which involves: (A) mixing ethanol with volume ratio of 2-3:1 and aqueous ammonia solution with mass fraction of 0.4-0.6% in solvent, adding 5-10 pts. wt. polystyrene microspheres and 18-22 pts. wt. surfactant cetyltrimethylammonium bromide, subjecting solution to ultrasonic dispersion treatment at 40-80 degrees C for 20-40 minutes, ultrasonic frequency is 30-40 kilohertz, heating solution to 30-50 degrees C, and stirring at constant speed for 30-60 minutes, adding 18-24 pts. wt. ethyl orthosilicate, reacting for 15-20 hours, removing the solvent from the solution, washing solid product and dry to prepare porous nano-silicon dioxide coated polystyrene microspheres, adding porous nano-silicon dioxide coated polystyrene microspheres to tetrahydrofuran solvent, heating solution to 40-50 degrees C, stirring for 20-40 minutes, keeping for 2-6 hours, removing the solvent from the solution, placing solid product in chloroform solvent, adding 36-55 pts. wt. nano-nickel iron oxide-graphene composite material and 4-8 pts. wt. crosslinking agent AlCl3, heating solution to 50-80 degrees C, and reacting for 6-12 hours, removing the solvent from the solution, washing solid product and drying, preparing ultra-highly cross-linked polystyrene microspheres, loading with porous nano silicon dioxide, placing polystyrene microsphere loading hole nano silicon dioxide in atmosphere resistance furnace, and passing argon protection, temperature rise rate of the atmosphere resistance furnace is 1-3 degrees C/minutes, heating up to 520-560 degrees C, heat preservation for 2-5 hours, placing solid product in dilute hydrofluoric acid solution, etching to remove silicon dioxide; and (B) filtering solution, washing and drying to obtain final product.