▎ 摘　　要

NOVELTY - The method involves cutting a graphene film (3) into a desired specification shape, and cutting a permeation through hole (4) of a design requirement on the graphene film. The solder metal in the molten bath in the middle of a substrate (1) is placed and a protective atmosphere is blowed. The substrate to melt the solder metal in the molten bath is heated and the through hole region of the graphene film is placed on the molten bath. An ultrasonic vibrating rod (7) is used to press the through-hole region of the graphene film to the through hole of the molten solder metal completely immersed in the graphene film, heat and open the ultrasonic vibration for 0.1 to 300 s, and raise the ultrasonic vibrating rod. The graphene film is taken out to complete the preparation of the metal solder joint of the graphene film surface mount electronic device. USE - Method for preparing graphene film metal solder joints. ADVANTAGE - The solder metal rapidly fills the through holes and penetrates into the through-hole edge of the graphene film layer to form a good metallurgical bond with the graphene film thereby realizing the preparation of metal bonding points with excellent bonding properties at any position of the graphene film. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the preparation of graphene film surface patch and through hole electronic device metal solder joint. Substrate (1) Melting groove (2) Graphene film (3) Permeation through hole (4) Ultrasonic vibrating rod (7)