▎ 摘　　要

NOVELTY - The semiconductor has a metal layer (120) fixed on a surface of a substrate (100). A main body of the substrate is connected with a graphene plate (110),where the graphene plate is made of graphene material. A chip (200) is bonded on the substrate. The main body of the substrate is provided with a metal pin (300) extending outwards. The metal pin is electrically connected with the metal layer. The metal layer is provided with a first surface plating layer and a second surface plating layer. The first surface plating layer and the second surface plating layer are respectively located on two side surfaces of the graphene plate. USE - Packaging semiconductor for electronic product (claimed). ADVANTAGE - The semiconductor has better radiating performance, improves brittleness of a product, and avoids cracking. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor packaging method. DESCRIPTION OF DRAWING(S) - The drawing shows a front partial sectional view of a packaging semiconductor for electronic product.