▎ 摘　　要

NOVELTY - The composite structure heat conducting plate has m metal layers and n graphite layers. The m metal layers and the n graphite layers are alternately arranged and assembled by a vacuum diffusion bonding process. The thickness of the metal layer is 0.005-0.1mm. The thickness of the graphite layer is 0.01-0.15mm. The graphite layer is a naturally synthesized graphite film, a graphite film is prepared from a polymer organic film, or a graphene-assembled graphite film. The metal foil is copper foil, gold foil or titanium alloy foil. The copper foil is preferably oxygen-free copper. USE - Composite structure heat conducting plate for use in electronic chip industry. ADVANTAGE - The composite structure heat conducting plate adopts flexible metal foil and flexible high heat-conducting graphite film multi-layer composite structure, and is configured to flexibly realize various complex anomalous structure. The vacuum diffusion bonding process is configured to effectively fill the gap between the material, improve the connection strength between the metal layer and the graphite layer, and contact the heat resistance between metal layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the composite structure heat conducting plate. (Drawing includes non-English language text).