▎ 摘　　要

NOVELTY - Method for preparing a high abrasion resistance chemical mechanical polishing pad, comprises (S1) mechanically dispersing a filler and a surfactant in an organic solvent to obtain a dispersion, (S2) adding a resin solution to the dispersion obtained in the step (S1), and stirring to obtain resin slurry, and (S3) coating the resin slurry obtained in the step (S2) on a transparent film coiled material, and preparing the high-abrasion resistance chemical mechanical polishing pad through post treatment. USE - The high abrasion resistance chemical mechanical polishing pad is used in a chemical mechanical polishing process in the production of semiconductor chips (claimed). ADVANTAGE - The method improves the physical and mechanical properties of a polyurethane film formed by condensation, prolongs the service life of a polishing pad, and improves the stability of polishing performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the high abrasion resistance chemical mechanical polishing pad prepared by the above method.