▎ 摘　　要

NOVELTY - Directional high thermal conductivity thermal interface thermal conductivity material comprises graphite paper and silicone rubber. The material is prepared by (i) taking graphite paper as the thermal conductive material of the matrix; (ii) using silicone rubber as the interface layer; (iii) carrying out surface treatment of the substrate; (iv) placing layer of spreading graphite paper; (v) using a spraying machine to spray a layer of silicone rubber with uniform thickness on the surface of the graphite paper; (vi) placing a layer of spread graphite paper obtained in step (iii); (vii) repeating the operations of steps (v) and (vi) to certain height; (viii) applying continuous pressure of 2x 105 Pa at 150 degrees C to solidify composite material; and (ix) shearing certain thickness in the direction perpendicular to the spreading direction of the composite material to obtain formed graphite-silicone rubber directional high thermal conductivity thermal interface thermal conductivity material. USE - The directional high thermal conductivity thermal interface thermal conductivity material is useful for high thermal conductivity graphite-based thermal interface composite material structure (claimed). ADVANTAGE - The graphite paper is used as the base material, which does not require high-temperature graphitization treatment, and has a relatively simple preparation process and a lower preparation cost. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for: a high thermal conductivity graphite-based thermal interface composite material structure, comprising a directional high thermal conductivity thermal interface thermal conductive material, a heat dissipation material, a heat-generating electronic component, a thermal interface thermal conductive material embedded in the gap between the heat dissipation material and the heating electronic component, where both ends of the graphite layer in the thermal interface heat-conducting material are respectively connected to the heat-dissipating material and the heat-generating electronic component.