▎ 摘　　要

NOVELTY - A model lubricating resin for semiconductor packaging mold, wherein the preparation raw material comprises epoxy resin, curing agent, accelerating agent and release agent; the curing agent is phenolic resin; based on 100 parts of total amount of epoxy resins and curing agent; and the accelerator content is 0.5 to 5 parts. USE - The model lubricating of resin is useful for semiconductor packaging mold, which is useful in electronic device package, preferably for packaging protection of small surface mounting device. ADVANTAGE - The resin has excellent fluidity at high temperature, and is capable of fully filling some ultra-small injection plastic opening device, effectively avoiding the problem that the non-filling position continuous operation caused by bad local filling is difficult to recover, and improving the working efficiency.