▎ 摘　　要

NOVELTY - Composite solder comprises copper powder, small layer of graphene and titanium hydride. USE - The solder is useful for brazing quartz short fiber reinforced silica composite material and invar alloy (claimed). ADVANTAGE - The solder ensures 5-15 MPa shear strength and 200% increased amplitude. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the solder, comprising (i) taking 50-80% copper powder and 20-50% titanium hydride powder, and ultrasonically cleaning with acetone, (ii) uniformly paving the washed copper powder on the surface of the silicon wafer, placing the silicon wafer carrying the copper powder on a heating table of the PECVD apparatus, vacuuming to below 1 Pa, accessing hydrogen, raising the temperature at a rate of 10-30 degrees C/minutes to a growth temperature of 550-650 degrees C, stop accessing hydrogen, changing to CH4 and Ar gas, adjusting the flow ratio of Ar and CH4, continuously heating at 750-850 degrees C, opening the radio frequency, stopped plasma after 40-90 minutes of sputtering, orderly closing the radio frequency, heating, accessing gas, always introducing the gas during the cooling process, where the flow rate of Ar is 20-50 sccm, maintaining the pressure at 400-600 Pa, and cooling at room temperature to obtain small layer of graphene-doped copper powder, (iii) mechanically mixing of VFG/Cu powder and TiH2, and mixing the small layer of graphene-doped Cu powder with the TiH2 powder and ball milling for 1.5-5 hours.