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  • 专利标题:   Preparing high-temperature-resistant low expansion coefficient copper clad laminate, involves coating high heat-conducting medium layer on one side of aluminum substrate, installing copper foil layer on one side of medium layer, and coating heat dissipation adhesive layer on other side of substrate.
  • 专利号:   CN113549408-A
  • 发明人:   LI Y, LIU Q, SU X
  • 专利权人:   ANHUI HONGHAI NEW MATERIAL CO LTD
  • 国际专利分类:   C09J011/04, C09J179/08, C09J183/05, C09J183/07, C09J007/29, C09J007/30, H05K003/02
  • 专利详细信息:   CN113549408-A 26 Oct 2021 C09J-007/30 202225 Chinese
  • 申请详细信息:   CN113549408-A CN10782091 12 Jul 2021
  • 优先权号:   CN10782091

▎ 摘　　要

NOVELTY - A preparation method of high-temperature-resistant low expansion coefficient copper clad laminate, involves coating a high heat-conducting medium layer on one side of an aluminum substrate, installing a copper foil layer on one side of the high heat-conducting medium layer, and coating a high heat-dissipation adhesive layer on the other side of the aluminum substrate to obtain a final product. USE - Preparation method of high-temperature-resistant low expansion coefficient copper clad laminate. ADVANTAGE - The high-temperature-resistant low expansion coefficient copper clad laminate is directly obtained.