• 专利标题:   Integrated sensor module for use in electronic device, has sensing unit, electrode layer, and connection portion that are electrically connected by connection portion, where sensing unit is formed on surface of flexible polymer substrate.
  • 专利号:   KR2334798-B1
  • 发明人:   KIM S K, BAEK S H, GANDLA S
  • 专利权人:   UNIV SUNGKYUNKWAN RES BUSINESS FOUND
  • 国际专利分类:   G06F003/041, H01B001/04, H01B005/14
  • 专利详细信息:   KR2334798-B1 02 Dec 2021 G06F-003/041 202208 Pages: 19
  • 申请详细信息:   KR2334798-B1 KR165332 01 Dec 2020
  • 优先权号:   KR165332

▎ 摘  要

NOVELTY - The integrated sensor module (10) has a sensing unit (200) formed on a surface of a flexible polymer substrate (100), and an electrode layer (300) formed on another surface of the substrate. Several micropores are vertically formed inside the substrate, and a connection portion is formed on surfaces of the micropores. The sensing unit, the electrode layer and the connection portion are included with glassy carbon. The sensing unit and the electrode layer are electrically connected by the connection portion. The flexible polymer is made of aromatic hydrocarbons. USE - Integrated sensor module used in touch panel of electronic device (claimed) e.g. organic LED (OLED) image display device. ADVANTAGE - The integrated sensor module has excellent stability, and prevents noise generation and deterioration of mechanical properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing an integrated sensor module. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram illustrating the manufacturing process of an integrated sensor module. Integrated sensor module (10) Flexible polymer substrate (100) Sensing unit (200) Electrode layer (300) Fine hole (400) Infrared laser (600)