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  • 专利标题:   Low-temperature curable graphene-silver conductive paste used for preparing electronic device, optoelectronic device and flexible circuits, comprises graphene-silver nanocomposite, organic binder, organic carrier and additive.
  • 专利号:   CN106205776-A
  • 发明人:   FENG B, GU X, ZHAO X, ZHANG Y, LIU P, JIN X, CUI L
  • 专利权人:   ZHEJIANG ASIA GEN SOLDERING BRAZING MA
  • 国际专利分类:   H01B001/22, H01B001/24
  • 专利详细信息:   CN106205776-A 07 Dec 2016 H01B-001/22 201721 Pages: 10 Chinese
  • 申请详细信息:   CN106205776-A CN10670210 14 Aug 2016
  • 优先权号:   CN10670210

▎ 摘　　要

NOVELTY - A low-temperature curable graphene/silver conductive paste comprises 45-85 %mass graphene/silver nanocomposite, 5-15 %mass organic binder, 15-40 %mass organic carrier and 0-2 %mass additive. USE - Low-temperature curable graphene-silver conductive paste is used for preparing electronic device, optoelectronic device (all claimed) and flexible circuits. ADVANTAGE - The low-temperature curable graphene-silver conductive paste has excellent flexibility. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of low-temperature curable graphene/silver conductive paste.