▎ 摘　　要

NOVELTY - High thermal conductivity electromagnetic shielding material module comprises a heat conduction layer, and a heat dissipation layer, where the heat conduction layer and the heat dissipation layer are made in order from bottom to top, the heat conduction layer is a polymer heat conduction adhesive film, and the heat dissipation layer is copper foil, aluminum foil or graphite sheet. USE - The high thermal conductivity electromagnetic shielding material module is used as heat dissipation material for chip, LED or other electronic component, and as electronic magnetic shielding material (all claimed) in high frequency and high power electronic device for synchronously performing thermal management and material of electromagnetic interference (EMI) shielding. ADVANTAGE - The electromagnetic shielding material has high heat conducting performance, excellent radiating performance and excellent electromagnetic shielding performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the high thermal conductivity electromagnetic shielding material module, which involves (i) placing the polymer elastomer particles and the thermally conductive filler in a container and uniformly mixing, and filtering out the excess thermally conductive filler with a filter cloth to obtain composite particles, and (ii) preparing the high thermal conductivity electromagnetic shielding material module on the heat dissipation material by a polymer molding processing method.