▎ 摘　　要

NOVELTY - The bus bar has an overlapping surface (2), and a non-overlapping surface (1). A silver underlayer (3) is attached to the overlapping surface and the non-overlapping surface of the copper bus bar through magnetron sputtering technology. A graphene film layer (4) is coated on the silver bottom layer of the non-overlapping surface. After the surface modification treatment, the thickness of the silver bottom layer is 8-12 ~mm, and the thickness of the graphene film layer is 80-100 ~mm. The copper bus bar is made of 0.4-1% silver, 2-3.5% boron, 0.003-0.005% titanium, 0.007-0.012% manganese, 0.002-0.004% vanadium, 0.002-0.03% strontium, 0.002-0.05% cobalt, 0.001-0.003% nickel, 0.002-0.004% rare earth oxide, the rest is Cu and unavoidable impurities. USE - Surface modified copper bus bar. Uses include but are not limited to large hydropower stations, nuclear power plants, subways, airports, high-speed trains, and high-tech products. ADVANTAGE - The surface modified copper bus has improved conductivity, withstand voltage performance, local discharge performance, tensile strength and wear resistance, and high conductivity of copper silver alloy, and can improve the conductive performance and radiating performance of the existing copper bus, with good comprehensive electric performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a surface-modified copper bus bar. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the structure of the surface-modified copper bus bar. Non-overlapping surface (1) Overlapping surface (2) Silver underlayer (3) Graphene film layer (4)