• 专利标题:   Conductive material comprises conductive paste comprising adhesive, solvent and metal particles, preferably silver particles and copper particles, and conductive additive comprising graphene provided with a graphene conductive film.
  • 专利号:   CN114155994-A
  • 发明人:   REN J, YANG F, GUANG Y, LIN L, YAO T
  • 专利权人:   SHENZHEN HIDRAMAN ELECTRONIC CO LTD
  • 国际专利分类:   H01B001/22, H01B001/24, H01B013/00, H01B005/14
  • 专利详细信息:   CN114155994-A 08 Mar 2022 H01B-001/22 202254 Chinese
  • 申请详细信息:   CN114155994-A CN11576795 21 Dec 2021
  • 优先权号:   CN11576795

▎ 摘  要

NOVELTY - Conductive material comprises conductive paste comprising metal particles, and conductive additive. The conductive additive comprises graphene. The surface and/or the inside of the graphene is provided with a graphene conductive film. The graphene comprises a single-layer graphene and/or double-layer graphene, and the thickness of the graphene conductive film is 0.334 nm. USE - Conductive material e.g. low-temperature electronic conductive slurry e.g. silver slurry and copper slurry, for an electronic device. ADVANTAGE - The conductive material has improved conductivity and physical properties, and reduces the direct current resistance loss of the conductive slurry, improves the conductivity of the low-temperature curing conductive paste, and improves the physical performance of the slurry after curing e.g. wear resistance and toughness to improve the reliability of the paste after curing. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a preparation method of conductive material. DESCRIPTION OF DRAWING(S) - The drawing shows a structure schematic diagram of a conductive material. Conductive paste (100) Internal graphene conductive film (200)