▎ 摘　　要

NOVELTY - The preparation method involves adding hydrogen iodide solution, after mixing medium particle synthetic diamond powder, silver powder and graphene powder. The hydrogen iodide solution is dried and exposed to obtain medium particle synthetic diamond powder with silver/graphene loaded on surface. The synthetic diamond powder is compressed to obtain a diamond powder skeleton. The pure aluminum block is placed on the diamond powder skeleton to heat infiltrate. The pure aluminum block is cooled to obtain a semifinished composite material. The obtained semifinished composite material is subjected to silvering treatment to obtain a high thermal conductivity composite material. USE - Preparation method of high thermal conductivity composite material (claimed) used in semiconductor, chip packaging, industrial control, and household appliance. ADVANTAGE - The method provides high heat-conducting composite material with high room temperature heat conductivity, high strength, plastic toughness, high thermal conductivity and low thermal expansion rate. The high heat-conducting composite material has excellent thermal stability and thermal shock resistance.