▎ 摘　　要

NOVELTY - Thermal diffusion sheet using hole filling (100) comprises a plate-shaped support layer (1) in which holes are vertically disposed; thermal diffusion material (5) which is filled in the hole of the support layer; and adhesive film (3) which is disposed on both sides of support layer to cover the filled thermal diffusion material. USE - Thermal diffusion sheet using hole filling. ADVANTAGE - The thermal diffusion sheet has increased thermal conductivity. As the thermal diffusion material is sealed by the adhesive layer in a state in which the hole is filled in the support layer, the thermal diffusion material is effectively prevented from being lowered while the flexible characteristics of the support layer are improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of thermal diffusion sheet using hole filling (100) which involves hole forming step of forming multiple holes in the support layer (1); first adhesive film arrangement step of disposing an adhesive film (3) on the other surface of the support layer; hole filling step of filling each hole with a heat spreader in a state in which the adhesive film is located in the lower portion; and second adhesive film arrangement step of disposing an adhesive film on one surface of the support layer. DESCRIPTION OF DRAWING(S) - The drawing shows a longitudinal cross-sectional view of the thermal diffusion sheet using hole filling. Support layer (1) Adhesive film (3) Thermal diffusion material (5) Hall (11) Thermal diffusion sheet using hole filling (100)