• 专利标题:   Silicene electronic device for switching device, comprises silicene material layer doped with preset group metals, and comprises region formed as single layer or bi-layer, and another region formed as multilayer, and highly doped region.
  • 专利号:   US2021005731-A1, US11245021-B2
  • 发明人:   OH Y, JUNG J, KWON H, SEO W, JEON I
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   H01L029/16, H01L029/45, H01L029/786
  • 专利详细信息:   US2021005731-A1 07 Jan 2021 H01L-029/45 202107 Pages: 16 English
  • 申请详细信息:   US2021005731-A1 US028205 22 Sep 2020
  • 优先权号:   KR128534

▎ 摘  要

NOVELTY - A silicene electronic device (100) comprises a silicene material layer (110) having a two-dimensional honeycomb structure formed by silicon atoms, is doped with material of group I, group II, group XVI, and group XVII, and comprises a low-doping concentration region lowly doped with a p-type dopant or a n-type dopant, and a high doping concentration region highly-doped with a p-type dopant or a n-type dopant, and an electrode material layer formed on the high doping concentration region. The silicene material layer comprises a region (r1) formed as a single layer or a bi-layer and a region (r2) formed as a multilayer, and the highly doped region formed in the (r2) region. USE - Silicene electronic device used for switching device e.g. transistor such as field effect transistor. ADVANTAGE - The silicene electronic device has reduced formation of an interface state on a surface of the silicene material layer, since the upper intermediate layer is located between the silicene at layer and the electrode material layer, is manufactured by simple method by dopant-free process on contact region, by reducing an implantation method. DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of the silicene electronic device. Silicene electronic device (100) Silicene material layer (110) P-type doping regions (111,112,113) Intermediate layers (120,121,122) Graphene layers (130,131,132) Electrode material layers (140,141,142) Electrode material protection layers (150,151,152) Upper gate intermediate layer (161) Upper gate insulating layer (163) Upper gate electrode (165) Lower gate electrode (171) Lower gate insulating layer (173) Lower gate electrode (175)