▎ 摘　　要

NOVELTY - The structure has multiple graphene layers respectively arranged with multiple adhesive layers, where each graphene layer is formed with same thickness, length and width and the adhesive layers is formed with same thickness, length and width of the graphene layers. The graphene layers are formed with a laminated structure, where an end of the laminated structure is spirally curled along length direction to form a cylindrical helical coil. Top and bottom surfaces of the cylindrical helical coil are spirally rolled between the graphene layers and the adhesive layers. USE - Graphene thermal interface layer based heat radiating structure. ADVANTAGE - The structure realizes effective use of high in- plane thermal conductivity of graphene for efficient heat dissipation encapsulating effect. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: (1) a graphene thermal interface layer based heat radiating structure manufacturing method (2) a chip package structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a graphene thermal interface layer based heat radiating structure.