▎ 摘　　要

NOVELTY - The cover (1) has a lower radiating top cover (2) and an upper radiating top cover (4) respectively located at two opposite sides of a soaking layer structure (3). The lower radiating top cover covers a chip (6), where an inner heat conducting coefficient of the soaking layer structure is higher than the inner heat conducting coefficient of the lower radiating top cover and the inner heat conducting coefficient is used for describing a heat conducting rate of an object along vertical direction of heat conducting direction. A heat equalizing layer structure covers an area opposite to the chip in the lower radiating top cover. The soaking layer structure is made of graphite, graphene, carbon nano tube and diamond materials. USE - Radiating cover for use in a packaging structure (claimed) of a chip. ADVANTAGE - The cover imprives the radiating efficiency of the chip and increases the effective radiating area on the radiating cover. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for packaging a chip. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a radiating cover. 1Radiating cover 2Lower radiating top cover 3Soaking layer structure 4Upper radiating top cover 5Substrate 6Chip 21Lower cover plate 22Cover edge 41Upper cover plate 71Heat conducting layer 72First adhesive layer 73Second adhesive layer