▎ 摘　　要

NOVELTY - Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents and the resin is based on bio-based dimer acid glycidyl ester modified multifunctional cycloaliphatic epoxy resin as the main resin. USE - The method is useful for preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate. ADVANTAGE - The method prepares halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate with a dielectric constant of 3.83.9, dielectric loss (10G) of 0.005-0.007, Tg greater than 200degrees Celsius, T288 greater than 120 minutes, flame retardant up to FV0 level, and water absorption less than 0.1%.