• 专利标题:   Preparation of graphene nanoribbon by growing carbide layer on silicon substrate chip, growing cubic silicon carbide heteroepitaxial film, injecting carbon ions, pyrolyzing to generate carbon film, placing on copper film, and annealing.
  • 专利号:   CN102674318-A, CN102674318-B
  • 发明人:   GUO H, TANG X, ZHANG Y, ZHANG K, ZHAO Y
  • 专利权人:   UNIV XIDIAN
  • 国际专利分类:   C01B031/02, C30B029/02
  • 专利详细信息:   CN102674318-A 19 Sep 2012 C01B-031/02 201338 Pages: 7 Chinese
  • 申请详细信息:   CN102674318-A CN10176499 31 May 2012
  • 优先权号:   CN10176499

▎ 摘  要

NOVELTY - Preparation of graphene nanoribbon based on copper (Cu) film-assisted annealing carbon (C) injection includes growing carbide layer on washed silicon (Si) substrate chip; growing a cubic silicon carbide (3C-SiC) heteroepitaxial film; manufacturing a mask plate consisting of an isolating belt; injecting C ions into an ion injection band area in 3C-SiC sample wafer by the mask plate; heating the 3C-SiC sample wafer in an epitaxial furnace; pyrolyzing 3C-SiC in the ion injection band area to generate carbon film; placing on Cu film; placing in argon (Ar) gas; and annealing. USE - Preparation of graphene nanoribbon (claimed) useful for manufacturing microelectronic device. ADVANTAGE - The method has lower cost, higher safety, and lower pyrolysis temperature of 3C-SiC; and provides graphene nanoribbon with good continuity. DETAILED DESCRIPTION - Preparation of graphene nanoribbon based on Cu film-assisted annealing C injection comprises: (A) standard washing 4-12-inch Si substrate chip; (B) placing the washed substrate chip into chemical vapor deposition (CVD) system reaction chamber; and vacuumizing the reaction chamber at 10-7 mbar; (C) gradually heating a reaction chamber to carbonization temperature of 1000-1200 degrees C under hydrogen (H2) protection; blowing propane (C3H8) at 30 ml/minute; carbonizing the substrate for 4-8 minutes; and growing a carbide layer; (D) after instantly heating the reaction chamber to 1200-1350 degrees C, blowing C3H8 and silane (SiH4) for 30-60 minutes; gradually cooling to room temperature under H2 protection; and finishing the growth of cubic silicon carbide (3C-SiC) heteroepitaxial film; (E) manufacturing a mask plate consisting of an isolating belt having a width of 100-200 nm and ion injection width of 50-200 nm; (F) injecting 5x 1014-5x 1016 cm-2 C ions with an energy of 15-45 keV into an ion injection band area for the 3C-SiC sample wafer by the mask plate; (G) placing the 3C-SiC sample wafer injected with C ions into an epitaxial furnace; regulating the pressure in the epitaxial furnace at 0.5-1x 10-6 Torr; blowing Ar gas at 500-800 ml/minute into the furnace; heating at 1200-1300 degrees C; keeping at constant temperature for 30-90 minutes; and pyrolyzing 3C-SiC in the ion injection band area to generate carbon film; and (H) placing the generated carbon film sample piece on the Cu film; placing them in Ar gas with flow rate of 20-100 ml/minute; annealing for 10-20 minutes after heating at 900-1200 degrees C; regenerating the graphene nanoribbon by the carbon film; taking out Cu film; and obtaining nanomaterial mutually consisting of isolating belt and graphene nanoribbon on the epitaxial 3C-SiC.