▎ 摘　　要

NOVELTY - Low dielectric strength composite material comprises 90-120 pts. wt. thermotropic liquid crystal polymer material, 5-10 pts. wt. thermosetting resin, 20-30 pts. wt. silane modified nano boron nitride powder, 10-15 pts. wt. hydroxy modified graphene, 10-20 pts. wt. inorganic filler, and 0.2-1.5 pts. wt. other auxiliary agents. USE - The composite material is useful in communication (claimed), preferably Fifth generation (5G) communication ADVANTAGE - The composite material has high tensile strength and bending strength, and low dielectric strength which reduces the influence of the signal, can be widely applied to the field of 5 G communication. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the low dielectric strength composite material, comprising (a) uniformly mixing thermotropic liquid crystal polymer material, thermosetting resin, inorganic filler and other auxiliary agent to obtain a mixed material I, (b) uniformly mixing silane modified nano boron nitride powder and hydroxy modified graphene to obtain the mixed material II, (c) adding the mixed material I to the extruder from the main feeding port, adding the mixed material II to the extruder from the side feeding port, melting, extruding and granulating, and obtaining the composite material.