▎ 摘　　要

NOVELTY - Preparing high thermal conductivity graphene heat dissipation film includes taking 20-30 pts. wt. styrene acrylic resin, 20-25 pts. wt. thermally conductive composite filler, 30-40 pts. wt. modified epoxy resin, 1-5 pts. wt. curing agent, 1 pts. wt. defoamer and 2 pts. wt. curing accelerator, adding styrene acrylic resin, thermally conductive composite filler, modified epoxy resin, curing agent and curing accelerator into the reaction kettle, and heating up to 70-85 degrees C at a heating rate of 5 degrees C/min at a speed of 280r/min, stirring for 30-60 minutes, adding defoamer and continue stirring for 15 minutes under the conditions of constant temperature and speed to obtain the first mixture. The first mixture is transferred to a mold, and cured in a vacuum oven at a temperature of 150 degrees C for 2 hours, and then cured at a temperature of 200 degrees C for 2 hours to obtain the high thermal conductivity graphene heat dissipation film. USE - Method for preparing high thermal conductivity graphene heat dissipation film. ADVANTAGE - The method enables to prepare high thermal conductivity graphene heat dissipation film, which has excellent heat resistance, water resistance, solvent resistance, abrasion resistance and scratch resistance. Modified epoxy resin has strong toughness, impact resistance and flame retardancy due to the addition of polyurethane. The thermally conductive composite filler gives the heat dissipation film higher thermal conductivity, heat dissipation performance, and wear resistance and scratch resistance. The reasonable combination of boron nitride nano and graphene oxide overcomes the shortcomings of a single thermally conductive filler and exerts its synergistic effect, can form a heat conduction path or a heat conduction network, and greatly improving the thermal conductivity and other physical properties of the composite material.