▎ 摘　　要

NOVELTY - The system has electronics (250) that have a metal-oxide-semiconductor structure, several graphene-based sensors and interconnects which are configured to electrically connect the electronics to the graphene-based sensors. A polymer layer (204) extends between the electronics and the graphene-based sensors so that the electronics are prevented from directly contacting the graphene-based sensors. The electronics, the graphene-based sensors, the interconnects, and the polymer layer are configured to have a thickness that allow the entire system to bend to have a bending radius less than 10 mm. USE - Physically compliant, three-dimensional (3D), heterogeneously integrated system. ADVANTAGE - The reliable processes of making the IC flexible are realized by using a sequential-etch-back method, without any performance degradation. The fully compliant electronic system free from any rigid component, organized in 3D coin architecture for maximized area efficiency and reduced thermal impact on skin/cells, can be manufactured using a low-temperature, CMOS compatible heterogeneous integration scheme. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for making a physically compliant, 3D, heterogeneously integrated system. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the physically compliant, three-dimensional, heterogeneously integrated system. Substrate (202) First polymer layer (204) Soft polymer (210) Electronic (250) Conducting layer (258)