▎ 摘　　要

NOVELTY - The device has a cup cover located on a top part of a metal bracket i.e. reflecting cup. The metal bracket is provided with a metal pin that is embedded in the reflecting cup. An LED chip i.e. red light LED chip, a green light LED chip or a blue light LED chip, is arranged on the metal bracket. A packaging structure is arranged in a cavity of the reflecting cup and formed with a top-encapsulated glue film, a graphene layer and a bottom-encapsulated glue film, where lower surface of the Graphene layer is greater than a light emitting surface of the LED chip. The LED chip is electrically connected with the metal pin by a wire. USE - TOP-LED device. ADVANTAGE - The device can rapidly transfer heat of the light emitting surface of the LED chip to an inner wall of the reflecting cup through the graphene layer, and transmits the heat by the reflecting cup, avoids accumulation of heat in a packaging adhesive layer and packaging glue so as to effectively improve service life of the packaging adhesive layer, and ensures light emitting effect of the LED chip so as to improve reliability of a TOP-LED device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for manufacturing a TOP-device. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a TOP-LED device.