▎ 摘　　要

NOVELTY - The heat dissipation structure has a heating element. A heat dissipation film (520) is placed on the heating element to dissipate heat generated from the heating element, to outside. The heat dissipation film includes graphene quantum dots (GQDs). The heat dissipation film further includes at least one of graphene, carbon nanotubes (CNTs), and graphene oxide. USE - Heat dissipation structure using graphene quantum dots. ADVANTAGE - The GQDs are used in a variety of technical fields, e.g., bioimaging, drug delivery, photodetectors, solar cells, and biosensors due to chemical and physical properties, e.g., a high electrical conductivity, a high surface area, an excellent corrosion resistance, and a high chemical stability. The heat dissipation film including the GQDs is used, excellent heat dissipation properties is achieved. The heat dissipation film including the GQDs is used, heat generated from the heating element is efficiently dissipated to outside. The heat dissipation film is provided directly on the top surface of the semiconductor chip without an adhesive layer intervening, heat dissipation properties are improved and the heat dissipation structure serving as a semiconductor package has a small thickness. The heat dissipation properties of the heat dissipation film are further improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing a heat dissipation structure. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view for describing a method of manufacturing a heat dissipation structure. Semiconductor substrate (510) First surface (510a) Heat dissipation film (520) Solution (520B) Semiconductor chip (540)