▎ 摘　　要

NOVELTY - Interconnect structure comprises a dielectric layer, a conductive interconnect on the dielectric layer and a graphene cap layer on the conductive interconnect. The graphene cap layer contains graphene quantum dots, and has a carbon content of 80 wt.% or more and an oxygen content of 15 wt.% or less. USE - Interconnect structure used in electronic device (claimed). ADVANTAGE - The interconnect structure is used for reducing the resistance of a conductive interconnect and limiting and/or preventing the deterioration of electrical by maintaining the dielectric constant of a dielectric layer without changing the composition of a cap layer. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: An electronic device, which comprises a substrate and an interconnect structure on the substrate, where the interconnect structure has a dielectric layer, a conductive interconnect on the dielectric layer, and a graphene cap layer on the conductive interconnect. A method for manufacturing an interconnect structure, which involves: preparing a dielectric layer, placing a conductive interconnect on the dielectric layer, applying a graphene-containing composition onto the conductive interconnect, and drying the graphene-containing composition to form a graphene cap layer on the conductive interconnect. An interconnect structure, which comprises a dielectric layer, and a graphene cap layer facing the dielectric layer, and a conductive interconnect connected to the dielectric layer and the graphene cap layer. DESCRIPTION OF DRAWING(S) - The drawing shows schematic cross-sectional view of an interconnect structure. 110Dielectric layer 120Conductive interconnect 130Graphene cap layer 140Substrate