• 专利标题:   Heat sink for semiconductor laser, has graphene film layer that is coated with copper heat sink formed graphene and that is prepared on copper heat sink surface of copper heat sink.
  • 专利号:   CN106684700-A
  • 发明人:   TANG J, WEI Z, FANG X, FANG D, WANG D, WANG F, FENG Y, LI J, CHU X, WANG X
  • 专利权人:   UNIV CHANGCHUN SCI TECHNOLOGY
  • 国际专利分类:   H01S005/024
  • 专利详细信息:   CN106684700-A 17 May 2017 H01S-005/024 201739 Pages: 7 Chinese
  • 申请详细信息:   CN106684700-A CN10119890 02 Mar 2017
  • 优先权号:   CN10119890

▎ 摘  要

NOVELTY - The heat sink has a graphene film layer (1), and a copper heat sink (2). The graphene film layer is coated with a copper heat sink formed graphene. The graphene film layer is prepared on the copper heat sink surface of the copper heat sink. The graphene film layer can be single-layer graphene, oxidized graphene, multilayer graphene, graphene film layer prepared on the copper heat sink surface coated with a copper heat sink. USE - Heat sink for semiconductor laser. ADVANTAGE - The cost is low. The radiating performance is stable. The service life is long. The semiconductor laser performance is improved. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic structural diagram of the heat sink for semiconductor laser. Graphene film layer (1) Copper heat sink (2)