▎ 摘　　要

NOVELTY - The carrier board (2) has a circuit structure (2a) having a first side (20a), a second side (20b) opposing the first side, a dielectric layer, and a circuit layer bonded to the dielectric layer. The circuit layer of the first side and the circuit layer of the second side have multiple solder pads (212). A graphene layer serving as an insulation heat dissipating layer (2b) is arranged on one of whole surface of the first side and whole surface of the second side of the circuit structure and formed with multiple holes, with the multiple solder pads exposing from the holes. A rigid layer is bonded to the second side of the circuit structure through the bonding material. The holes extend into the rigid layer to expose the solder pads of the second side of the circuit structure. The rigid layer is made of conductive material or non-conductive material. USE - Semiconductor package carrier board for electronic package (claimed). ADVANTAGE - Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink, which is used as solder resist, the heat of the semiconductor package carrier board is conducted quickly, thus avoiding the problem that the heat is accumulated on the semiconductor package carrier board. The graphene layer which has high heat conductivity is used as the insulation heat dissipating layer or solder resist structure to improve the heat dissipating performance of the semiconductor package carrier board. Thus, electronic product has improved performance and is applied to high power product demanding high heat dissipating efficiency. The insulation heat dissipating layer has solder resist function and dissipates the heat generated by the semiconductor package carrier board quickly, thus making the overall performance and service life of the electronic package more stable. The conductive elements are set in contact with the insulation heat dissipating layer, such that the heat of the electronic package is conducted through the conductive elements through the insulation heat dissipating layer to the rigid layer, and the heat dissipating effect is enhanced. The product is highly reliable and durable, when the semiconductor package carrier board is applied to high-level product designed with high density circuit/high transmission speed. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for fabricating semiconductor package carrier board. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the electronic package. Semiconductor package carrier board (2) Circuit structure (2a) Insulation heat dissipating layer (2b) Sides of circuit structure (20a,20b) Solder pad (212)