▎ 摘　　要

NOVELTY - Heat conducting interface material comprises a layered structure including a first resin layer, a heat-conducting film layer compounded on the first resin layer and a second resin layer compounded on the heat-conducting film layer. USE - The material is useful in the electronic product and/or automobile field (claimed). ADVANTAGE - The material: reaches the comprehensive heat conduction performance up to 50 w/mk; has light weight and small volume as the power of home appliances/automobiles to the chip/battery increases and provides a good heat treatment plan for the intelligent development of automotive electronics. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing heat conducting interface material comprising (a) mixing the resin, curing agent and auxiliary agent, adding heat conducting filler vacuum mixing to obtain the heat conducting glue semi-finished product, (b) forming and curing the heat-conducting glue semi-finished product to obtain the heat-conducting gasket and (c) coating the heat conducting glue semi-finished product on the heat conducting film and solidifying to obtain the heat conducting interface material.