▎ 摘　　要

NOVELTY - A composition for use in three-dimensional (3D) printing of electronic devices, comprises at least triphenylamine (TPA) which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure. USE - A composition for use in three-dimensional printing of electronic devices (claimed). ADVANTAGE - Complete functional 3D electronic circuits and devices can be directly printed and created without the need to undergo any thermal or laser post-processing treatment. The TPA can be mixed with one or more powders for 3D printing based on the desired electrical and mechanical properties of the composition, such that the composition can be melted and extruded onto a structure, while maintaining the desired electrical characteristics. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) manufacture of composition which involves melting the TPA at a temperature of at least about 140degrees Celsius in an enclosed container for at least about 15 minutes, adding one or more powders to the container and stirring for about two hours for homogeneity, reducing the temperature to about 100degrees Celsius, applying a filament cap to the container, extruding a predefined length of a filament at a particular diameter, and cooling the filament into rolls for use in the 3D printing of electronic devices; (2) manufacture of a device which involves mixing UV curable liquid epoxy with at least one nanopowder to form a mixture, dispensing the mixture on a non-conducting glass surface, curing the dispensed mixture using an UV LED source, and melting the cured mixture to a semi-liquid state that is extruded from a print head to form the device; and (3) manufacture of a device which involves mixing UV curable liquid epoxy with TPA and at least one nanopowder to form a mixture, dispensing the mixture on a non-conducting glass surface, curing the dispensed mixture using a UV LED source, and melting the cured mixture to a semi-liquid state that is extruded from a print head to form the device.