• 专利标题:   Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications, comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction.
  • 专利号:   CN113881987-A
  • 发明人:   ZHENG Q, LI X
  • 专利权人:   UNIV SHAOYANG
  • 国际专利分类:   C25D005/18, C25D005/48, C25D005/52
  • 专利详细信息:   CN113881987-A 04 Jan 2022 C25D-005/18 202263 Chinese
  • 申请详细信息:   CN113881987-A CN11363887 17 Nov 2021
  • 优先权号:   CN11363887

▎ 摘  要

NOVELTY - A mercaptobenzene functionalized graphene/copper composite thermal conductive coating comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction. The sulfur atom in the mercaptobenzene molecular junction and the nano-copper form a strong sulfur-copper covalent bond through electron tunnelling to build an electron tunneling heat conduction path. The composite thermally conductive coating enables electrons to conduct freely. The mercaptobenzene functionalized graphene/copper composite thermal conductive coating is formed by reacting 4-amino-benzenethiol (A) with isoamyl nitrite and electron form graphene to obtain 4-mercapto-benzenediazonium (B), heating to release nitrogen to obtain 4-sulfanylphenyl radical (C), reacting with graphene (D) to obtain mercaptobenzene functionalized graphene (E), and electrodepositing copper ion to form mercaptobenzene functionalized graphene/copper compound. USE - Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications. ADVANTAGE - The mercaptobenzene functional graphene/copper composite thermal conductive coating has high heat conductivity coefficient and strong heat conducting ability. DETAILED DESCRIPTION - A mercaptobenzene functionalized graphene/copper composite thermal conductive coating comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction. The sulfur atom in the mercaptobenzene molecular junction and the nano-copper form a strong sulfur-copper covalent bond through electron tunnelling to build an electron tunneling heat conduction path. The composite thermally conductive coating enables electrons to conduct freely. The mercaptobenzene functionalized graphene/copper composite thermal conductive coating is formed by reacting 4-amino-benzenethiol of formula (A) with isoamyl nitrite and electron form graphene to obtain 4-mercapto-benzenediazonium of formula (B), heating to release nitrogen to obtain 4-sulfanylphenyl radical of formula (C), reacting with graphene of formula (D) to obtain mercaptobenzene functionalized graphene of formula (E), and electrodepositing copper ion to form mercaptobenzene functionalized graphene/copper compound of formula (F). An INDEPENDENT CLAIM is included for preparation of the mercaptobenzene functionalized graphene/copper composite thermal conductive coating, which involves (1) adding graphene to o-dichlorobenzene, magnetically stirring, dissolving 4-aminothiophenol in acetonitrile solution, adding to the graphene suspension, adding isoamyl nitrite, protecting under an inert atmosphere, diluting with N,N-dimethylformamide, using 0.45 mum organic membrane to separate suspended solids under vacuum conditions, washing with N,N-dimethylformamide until the filtrate is colorless, washing three times with absolute ethanol, drying to obtain mercaptobenzene functionalized graphene, and (2) directly co-depositing metal copper nanoparticles and mercaptobenzene-functionalized graphene on copper substrate.