▎ 摘　　要

NOVELTY - Preparing high thermal conducting additive silicone electronic potting adhesive, using component A, a component B, and main components containing modified vinyl dimethicone, graphene modified filler, hydrogenated silicone oil, cross-linking inhibitor, antifoaming agent and platinum catalyst, comprises mixing vinyl polydimethyl siloxane and allyl glycidyl ether, stirring at 50-60 degrees C for 30 minutes, obtaining modified vinyl dimethicone, mixing the solid filler and single-layer graphene, fully grinding in a grinder to obtain modified filler particles, mixing modified vinyl dimethicone and modified filler, placing in a vacuum kneader, performing vacuum blending at 90-120 degrees C for 50-100 minutes, discharging to obtain base material, uniformly mixing 85-95 wt.% base material, 5-15 wt.% hydrogenated silicone oil, 0.1-0.5 wt.% cross-linking inhibitor, and 2-5 wt.% antifoaming agent to obtain component A, and mixing base material and platinum catalyst, and obtaining component B. USE - The method is useful for preparing high thermal conducting additive silicone electronic potting adhesive. ADVANTAGE - The method uses allyl glycidyl ether to modify vinyl polydimethylsiloxane in the base material, which reduces the viscosity of the base material and optimize the process performance. The adhesive has improved mechanical properties and good lubricating effect between the particles. DETAILED DESCRIPTION - Preparing high thermal conducting additive silicone electronic potting adhesive, using component A , a component B, and main components containing modified vinyl dimethicone, graphene modified filler, hydrogenated silicone oil, crosslinking inhibitor, antifoaming agent and platinum catalyst, comprises (i) mixing vinyl polydimethyl siloxane and allyl glycidyl ether in a mass ratio of 4:1, stirring at 50-60 degrees C for 30 minutes, and obtaining modified vinyl dimethicone, (ii) mixing the solid filler and single-layer graphene, fully grinding in a grinder, and obtaining modified filler particles, where the adding amount of single-layer graphene is 0.1-0.5% of total amount of filler, (iii) mixing modified vinyl dimethicone and modified filler particles in a mass ratio of 0.8-1.2:1, placing in a vacuum kneader, performing vacuum blending at 90-120 degrees C for 50-100 minutes, discharging and obtaining base material, (iv) uniformly mixing 85-95 wt.% base material, 5-15 wt.% hydrogenated silicone oil, 0.1-0.5 wt.% crosslinking inhibitor, and 2-5 wt.% antifoaming agent, and obtaining component A, and (v) mixing the base material and the platinum catalyst in a mass ratio, and obtaining component B, where the adding amount of platinum catalyst is 0.1-3 % of total mass of binder. An INDEPENDENT CLAIM is also included for the high thermal conducting additive silicone electronic potting adhesive.