▎ 摘　　要

NOVELTY - Preparing graphene heating film on the surface of a polyimide (PI) insulating substrate involves preparing coarsened copper electrode, and implanting roughened copper electrode on the surface of PI substrate to form a PI-copper electrode substrate structure. The graphene heating paste is printed on surface of PI-copper electrode substrate, and graphene heating dry film is formed after baking. The graphene dry film is made as cover portion of the copper electrode, that results in forming ''PI-copper electrode-graphene'' heating layer structure. The PI cover film is treated with local openings, and PI cover film after opening and side of ''PI-copper electrode-graphene'' heating layer structure are subjected to hot pressing. The cover film opening position corresponding to copper electrode of ''PI-copper electrode-graphene'' heating layer structure is made to expose the copper electrode terminals, which are used to connect graphene heating film to external power supply and controller. USE - Method for preparing graphene heating film for battery on the surface of polyimide insulating substrate.