▎ 摘　　要

NOVELTY - A composition comprises a resin and a filler having a thermal conductivity of 1 W/m.K or more. The resin contains a polyimide resin. The filler is a filler (A) having an aspect ratio (average value of maximum length/average value of minimum length) of 1-1.9, and a filler (B) having an aspect ratio of 2 or more and an average maximum length of 10.5-200 mu m. The volume ratio of fillers (A) and (B) is 95:5-55:45. The total ratio of the fillers (A) and (B) is 15-80 vol.%. USE - Composition e.g. sheet-like composition for forming cured material for multilayer sheet used in heat-radiating component and electronic component (all claimed). Uses include but are not limited to semiconductor chip, wiring board, heat spreader, heat sink, display, LED, electric light, printed circuit board, integrated circuit and chip-scale package (CSP). ADVANTAGE - The composition provides components having excellent thermal conductivity and low elasticity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) cured material, which comprises the composition; (2) multilayer sheet, which comprises the composition or cured material, and an adhesive layer; (3) heat-radiating component, which comprises the multilayer sheet, composition or cured material; and (4) electronic component, which comprises the multilayer sheet, composition or cured material.