▎ 摘　　要

NOVELTY - Activation method before metallization of thick copper printed circuit board (PCB) hole involves (s1) preparing a suspension (A) with solid content of 0.1-1% by expanded graphite and pure water, and carrying out stripping operation by a high-pressure homogenizer to obtain graphene nanosheets dispersion liquid, (s2) preparing a suspension (B) with solid content of 0.1-0.5% by graphite oxide and pure water, and carrying out ultrasonic emulsification operation and high-pressure homogenizer stripping operation to obtain a graphene oxide nanosheets dispersion liquid, (s3) slowly adding the graphene oxide nanosheets liquid in graphene nano sheet dispersion liquid to obtain a graphene copper plating pre-activation liquid without a dispersant, and (s4) injecting the activating solution before copper plating of the graphene in an activating tank, and attaching activation layer to the hole wall of the drilled hole of the PCB in the activation liquid before copper plating of the graphene. USE - Activation method before metallization of thick copper printed circuit board hole. ADVANTAGE - The method does not need to use dispersant, less usage of graphene oxide dosage, stronger conductive performance, not easy to appear bubble blocking hole problem, and can make the hole wall of the drilling hole of the PCB board form the activating layer based on the non-dispersing agent. The graphene plating copper activating liquid is obtained by modifying the original hydrophobic, and graphene as to have strong hydrophilicity. DETAILED DESCRIPTION - Activation method before metallization of thick copper printed circuit board (PCB) hole involves (s1) preparing a suspension (A) with solid content of 0.1-1% by expanded graphite and pure water, and carrying out stripping operation by a high-pressure homogenizer to obtain graphene nanosheets dispersion liquid, (s2) preparing a suspension (B) with solid content of 0.1-0.5% by graphite oxide and pure water, and sequentially carrying out ultrasonic emulsification operation and high-pressure homogenizer stripping operation to obtain a graphene oxide nanosheets dispersion liquid, (s3) slowly adding the graphene oxide nanosheets dispersion liquid in the graphene nano sheet dispersion liquid, and performing hydrophilic modification operation on graphene by π-π adsorption formed by graphene oxide rich in carboxyl functional groups and hydroxyl functional groups and graphene to obtain a graphene copper plating pre-activation liquid without a dispersant, and (s4) injecting the activating solution before copper plating of the graphene in an activating tank, installing a printed circuit board (PCB) on a rotating material, immersing the PCB in the activating solution before copper plating of the graphene in the activating tank, and controlling the rotating material to drive the PCB to perform unidirectional rotation operation so the activating solution before copper plating of the graphene continuously flushes the hole wall of drilling hole of the PCB, and bubbles on the hole wall of the drilling hole of the PCB are discharged based on the flushing force of the activating solution before copper plating of the graphene and centrifugal force generated by rotation of the PCB, and attaching activation layer to the hole wall of the drilled hole of the PCB in the activation liquid before copper plating of the graphene. The size of the diameter of graphene in the graphene nanosheets dispersion liquid is 500 nm-1 µm. The size of diameter of graphene oxide in the graphene oxide nanosheets dispersion liquid is less than 200 nm.