▎ 摘　　要

NOVELTY - Epoxy resin composite board comprises 20-30 pts. wt. epoxy resin, 3-8 pts. wt. amine curing agent, 55-70 pts. wt. silicon powder, 5-9 pts. wt. graphene, 0.1-0.3 pt. wt. color paste, 0.1-0.3 pt. wt. flame retardant additive, 0.05-0.2 pt. wt. silane coupling agent and 0.5-2 pts. wt. natural mineral. The particle size of the silicon powder is 300-500 mesh and the particle size of natural minerals is 50-250 mesh. USE - Used as epoxy resin composite board. ADVANTAGE - The epoxy resin composite board: has improved scratch resistance, wear resistance and temperature resistance of the surface; utilizes graphene and the silane coupling agent, which makes it difficult to warp and deform. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing epoxy resin composite board, comprising uniformly dispersing the graphene in epoxy resin, preheating amine curing agent and silicon powder respectively, placing graphene-dispersed epoxy resin, amine curing agent and color paste into the reaction kettle, stirring, adding flame retardant additives and silane coupling agent, uniformly mixing, then introducing silicon powder into reaction kettle, stirring well to obtain the mixture, preheating the mold, adding natural minerals into the mixture, stirring and mixing to obtain the mixture, uniformly spreading the mixture on the preheated mold, heating, then cooling and demolding the semi-finished product, heating the semi-finished product, insulating and cooling twice to obtain final product.