▎ 摘　　要

NOVELTY - Wireless charging receiving end wafer module structure comprises multi-layer nano crystal layer overlapped together from up to down. The two adjacent nano- crystal layers (1) are bonded by heat-conducting double-sided adhesive tape (2). The outer surfaces of the nano wafer layers located in the uppermost layer and the lowermost layer are adhered with a polyethylene terephthalate film through a heat-conducting double-sided adhesive tape. The heat-conducting double-sided adhesive tape is a non-base material heat conductive adhesive tape. The high thermal conductivity nano-powder is cross-linked with the side chains of the rubber copolymer, so that the heat conducting adhesive forms a porous cross-linked network structure capable of conducting vertical heat conduction and a porous cross-linked network structure can form an interface adhesion force under the action of atmospheric pressure to form the adhesive force of the heat conductive double-sided adhesive tape. USE - Used as wireless charging receiving end wafer module structure. ADVANTAGE - The module structure has simple structure; relatively thin overall thickness and has good heat dissipation and heat conduction performance. DETAILED DESCRIPTION - Wireless charging receiving end wafer module structure comprises multi-layer nano crystal layer overlapped together from up to down. The two adjacent nano- crystal layers (1) are bonded by heat-conducting double-sided adhesive tape (2). The outer surfaces of the nano wafer layers located in the uppermost layer and the lowermost layer are adhered with a polyethylene terephthalate film through a heat-conducting double-sided adhesive tape. The heat-conducting double-sided adhesive tape is a non-base material heat conductive adhesive tape which is composed of heat-conducting adhesive. The heat-conducting adhesive is prepared by cross-linking a rubber copolymer modified with a side chain carboxy group and a high heat-conducting nano powder. The high thermal conductivity nano-powder is cross-linked with the side chains of the rubber copolymer, so that the heat conducting adhesive forms a porous cross-linked network structure capable of conducting vertical heat conduction and a porous cross-linked network structure can form an interface adhesion force under the action of atmospheric pressure to form the adhesive force of the heat conductive double-sided adhesive tape, so that the heat conductive double-sided tape can be repeatedly peeled and bonded to the nano-wafer layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the wireless charging receiving end wafer module structure. Nano- crystal layer (1) Heat-conducting double-sided adhesive tape (2)