▎ 摘　　要

NOVELTY - High stacking degree graphene modification based high thermal conductivity carbon plastic alloy comprises e.g. high-stacked graphene filler, thermosetting resin, coupling agent, resin diluent, curing agent, reinforcing filler and auxiliary agent; and the preparation includes (i) uniformly mixing graphene A and graphene B, adding to medium containing surfactant, and uniformly mixing in a homogeneous mixing device to obtain graphene solution, (ii) mixing nano-graphite microchip C and nano-graphite microchip D and then adding into medium containing surfactant, and uniformly mixing to obtain nano graphite microchip solution, (iii) mixing the above graphene solution and nano-graphite microchip solution, adding interface compatibilizer and bypassing agent, and mixing and compounding to obtain graphene mixture, and (iv) adding viscosity modifier to above graphene mixture, stirring uniformly, and granulating by spray drying to obtain high stacking graphene heat-conductive filler. USE - The high thermal conductive carbon plastic alloy is useful in industrial heat dissipation, illumination heat dissipation and heat dissipation of electronic devices. ADVANTAGE - The high thermal conductive carbon plastic alloy: has controllable thermal conductivity coefficient of 10-25 W/m.K. DETAILED DESCRIPTION - High stacking degree graphene modification based high thermal conductivity carbon plastic alloy comprises 5-50 wt.% high-stacked graphene filler, 30-55 wt.% thermosetting resin, 0.2-2 wt.% coupling agent, 1-5 wt.% resin diluent, 7-15 wt.% curing agent, 5-20 wt.% reinforcing filler and 2-5 wt.% auxiliary agent; and the preparation includes (i) uniformly mixing graphene A and graphene B, adding to medium containing 0.0035-0.1 wt.% surfactant, and uniformly mixing in a homogeneous mixing device to obtain graphene solution, (ii) mixing 1.5-4.5 wt.% nano-graphite microchip C and 3.5-7.8 wt.% nano-graphite microchip D and then adding into medium containing 0.005-0.123 wt.% surfactant, and uniformly mixing in a homogeneous mixing device to obtain nano graphite microchip solution, (iii) mixing the above graphene solution and nano-graphite microchip solution, adding 0.015-0.15 wt.% interface compatibilizer and 0.15-0.375 wt.% bypassing agent, and mixing thoroughly in the micro-mixer and compounding to obtain graphene mixture, and (iv) adding 0.015-0.075 wt.% viscosity modifier to above graphene mixture, stirring uniformly, and granulating by spray drying to obtain high stacking graphene heat-conductive filler. An INDEPENDENT CLAIM is also included for preparing high stacking degree graphene modification based high thermal conductivity carbon plastic alloy comprising taking the above mentioned raw materials, then pre-wetting the coupling agent and the high-stack graphene heat-conducting filler in the resin diluent, adding to thermosetting resin, adjusting the viscosity of the system by controlling the content of the diluent, pre-dispersing by high-speed stirring, and then adding curing agent, a filler, an auxiliary agent, then mixing, plasticizing and performing heat treatment to obtain high thermal conductivity carbon plastic alloy.