• 专利标题:   Producing coated metal alloy substrate for electronic device by scanning metal alloy substrate to determine three-dimensional surface profile of portion of metal alloy substrate and printing coating layer on metal alloy substrate.
  • 专利号:   WO2021118553-A1
  • 发明人:   WU K, YEH Y, CHANG C H
  • 专利权人:   HEWLETTPACKARD DEV CO LP
  • 国际专利分类:   B22F003/105, B22F007/04, B33Y070/10, B33Y080/00, C23C026/00
  • 专利详细信息:   WO2021118553-A1 17 Jun 2021 B22F-003/105 202163 Pages: 37 English
  • 申请详细信息:   WO2021118553-A1 WOUS065658 11 Dec 2019
  • 优先权号:   WOUS065658

▎ 摘  要

NOVELTY - A coated metal alloy substrate is produced by scanning metal alloy substrate to determine three-dimensional (3D) surface profile of at least a portion of metal alloy substrate; and printing greater than or equal to 1 coating layer on at least a portion of metal alloy substrate, where printing is adjusted according to the 3D surface profile of the metal alloy substrate. USE - Production of coated metal alloy substrate for electronic device (claimed). ADVANTAGE - The coated metal alloy substrate resulting from the process may have good esthetic properties, glossy surface finish, and good corrosion resistance with a relatively thin overall coating layer, which is lightweight Furthermore, the process may avoid polishing treatments, resulting in a more efficient process, preventing damage to the metal alloy substrate surface, and increasing corrosion resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) coated metal alloy substrate comprising metal alloy substrate and greater than or equal to 1 printed coating layer on at least a portion of the metal alloy substrate, where greater than or equal to 1 printed coating layer printed on the metal alloy substrate is based on a 3D surface profile of the metal alloy substrate; and (2) electronic device comprising housing which comprises the coated metal alloy substrate.